Customers look at Apple iPhone 5C and 5S at an Apple store in Beijing's Sanlitun area, September 30, 2014. The iPhone 6 will be sold in China from Oct 17, after rigorous regulator scrutiny led to Apple Inc reassuring the Chinese government that the smartp
Customers look at Apple iPhone 5C and 5S at an Apple store in Beijing's Sanlitun area, September 30, 2014. Reuters/Jason Lee

Apple’s obsession with thinner iPhones will continue with the iPhone 7 and probably beyond. KGI Securities analyst Ming-Chi Kuo says the company’s trying to build a handset 6.5 mm thick or about the size of an iPod Touch. Also read this.

The latest in this bi-annual exercise in slimming down the once portly iPhone is Apple’s plan to remove the 3.5 mm headphone jack in the upcoming iPhone 7. Replacing the jack, which is the universal standard for smartphones, will be EarPods that connect through the Lighting port.

Another symptom of Apple’s obsession with slimness is wireless charging. Word has it Apple intends to use a vibration motor and a coil in the built-in speaker for wireless charging. Another choice for the company is to use Qualcomm’s wireless charging technology through metal smartphone bodies.

Despite its slimness, the iPhone 7’s supposed features are formidable. It will come with 3 GB of RAM and much larger native storage capacity. It will sport a six-core A10 processor to replace the A9X chip. The phone will also have an OLED display made of sapphire.

Apple’s A9 chip is more powerful and efficient than its predecessor, the A9X. Taiwan Semiconductor Manufacturing Company (TSMC) will build the six-core SoC using 16 nm FinFET technology.

The new system-in-package chip packs great storage, RAM and other components that consume little internal space, but ensure higher performance, reports VCPost.

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