The next smartphone builds coming from Apple and Samsung, likely the rumoured iPhone 6 and the Galaxy Note 3, will have an improved device heat management technology, a new report said.

By using an inner component called 'ultra-thin heat pipes,' upcoming gadgets from the two tech giants, with powerful CPU and GPU plus massive battery, will be able to dissipate heat from inside and prevent a meltdown, according to reports by Taiwanese publication DigiTimes.

The new mobile device cooling system is ready for mass deployment by the end of 2013, the same report said, pointing to the possibility that the Note 3 will beat the iPhone 6 to the race.

Persistent reports have indicated that Samsung will rollout its new phablet version by September this year, while Apple's first oversized smartphone is not due until the first quarter of 2014.

It is understood too that HTC is on queue to adopt the same technology, which the company can then include on its rumoured issuance of the phablet-size HTC One Mega, with a 6-inch screen, later this year.

The new gadget cooling mechanism aims to replace the graphite plus foil cooling method, which DigiTimes said will soon be unable to cope with the latest gadget components' heat-creation capabilities.

Of particular concern for top-tier mobile device manufacturer is the prevailing standard of installing LTE chips with boards used in producing smartphones and tablet computers. By giving existing and upcoming devices the ability to access fast internet connection, they spawn higher temperature inside the device that potentially will lead to a breakdown.

But with the heat pipes inside the guts of the iPhone 6, the Note 3 and the One Mega, gadget overheating will be a thing of the past.

Already, a Snapdragon-powered smartphone from Taiwan's NEC is being primed for a commercial market circulation soon.

The mobile phone carries the same heat pipe with a 0.6mm diameter, DigiTimes said, adding that works have been ramped up to achieve an ideal volume production threshold by Q4 2013, geared for further acceleration in the following quarter