iPhone 6 New Information From Leaked Image
Rumours and speculations about iPhone 6 spread like wildfire on the internet, and yet another image has been leaked. Sources still continues to crack out more information about the most awaited smartphone this 2014 - the iPhone 6.
Enthusiasts cannot resist and get too excited on how this smartphone would satisfy their needs and wants.
@NowhereElseFr posted a picture on his twitter account showing the circuit parts of iPhone 6, and according to him the newly leaked image shows a comparison between the logic boards of iPhone 5s and iPhone 6. It is assumed that the next generation of iPhone will support Near Field Communication (NFC) and with faster Wi-Fi 802.11ac. These can be confirmed by examining the photos themselves.
This Wi-Fi 802.11ac will be very interesting to iPhone users. 802.11ac is a wireless networking standard that establishes a high-throughput WLAN and provides high-speed data transmission. Better Wi-Fi range and compatibility are expected on the incoming next generation iPhone.
"Of course most high-end Android smartphones come with both NFC and 802.11ac Wi-Fi, so a bigger screen is not the only way in which the iPhone 6 will be following its Android brethren, should these rumours turn out to be true," said NDTV.
It also shows that there are similarities of the leaked iPhone 6 PCB to its predecessors, but there is an extended or longer part on the top of the device. The internal components have some changes to their designs. The location of the components could be easily identified by using its predecessors' PCB. However, it is hard to leak more information for it is only a bare printed board and no actual chips were installed, MacRumors reports.
A few days ago, the other leaked photo from Taiwan showed the alleged iPhone 6 lightning port, headphone assembly and rear shell.
It is expected that at the coming last quarter of the year, Apple will have another outstanding market sales for their iPhone. Together with the company's supply chains, which include Foxconn, Pegatronn and Winstron, Apple will also have to deal with great mass production targets to meet the market demand.