Samsung Galaxy S6 Release in March 2015 to Sport Impressive Storage Technology
Samsung's constant releases have not swayed the company from following stricter timelines when it comes to its flagships. For instance, the company is reportedly poised to release the Samsung Galaxy S6 around March next year.
This is earlier compared to previous releases around April or June but still well within the first or second quarter tradition of Samsung. The Mobile World Congress will be held on March 2015 thus the anticipation building over the announcement of the device. Korean outlet Daum noted the company's plans to push release around March along with expected killer features.
ET News reported about a Samsung Insider citing a potential new technology on the Galaxy S6. The device may ship with a next-gen NAND flash storage. The technology goes by the name Universal Flash Storage with the S6 specifically incoporating the UFS 2.0. The switch to UFS is logical according to GSM Arena because it offers transfer speeds at SSD-like rate with cheap production costs like eMMC memory chips.
It is also faster than the latter which rates reaching up to 1.2GB/s. It requires less power thus offering the S6 better overheating and battery drain management capabilities. Specifically, the UFS 2.0 technology posted half the consumption power of the eMMC 5.0.
Samsung may need to up its game as Xiaomi has also been reportedly working on a UFS 2.0 NAND memory as well. This puts a pressure on Samsung knowing Xiaomi's current advancements and performance in the industry. Xiaomi now ranks third following Samsung and Apple with analysts seeing more gains in the future.
According to Slash Gear, other expected features of the device include a display similar to the Note 4 offering 2560 x 1440 resolution including a Snapdragon 810 processor. However, other reports also note that Samsung has been working on a new Exynos processor to double with the Snapdragon option.
Samsung has yet to release any official statement or information about the upcoming device.