The latest word has it the still to be announced Samsung Galaxy S7 has run into some serious overheating problems and will incorporate a liquid cooling system to overcome this issue.

This cooling system is generally used on overclocked gaming PCs but Samsung is expected to use a miniature version of the tech. The Galaxy S7 will probably feature small-pipes filled with liquid coolant located around heat-producing chipsets, said Chinese website UDN (via SlashGear).

The use of cooling systems on smartphones is still rare but Sony uses liquid cooling in its Xperia Z5 and Microsoft in its Lumia 950XL. Samsung is still experimenting with various types and shapes of pipes that would fit into the handset.

It’s also working on a solution to keep the handset slim. In this case, this means a handset not more than 0.6mm thick.

As for other rumoured specs, the Samsung Galaxy S7 is alleged to feature a 5.2-inch QHD display and will have either an Exynos 8890 chipset or Qualcomm’s Snapdragon 820 processor.

The Galaxy S7 might feature 4 GB of RAM, a 64 GB internal storage and a microSD card slot. On the camera front, the device will sport a 20 MP rear camera along with BRITECELL camera sensor. The primary camera may either be a 5 MP or 8 MP.

The phone will come with the bevy of connectivity options such as Wi-Fi 802.11ac, USB Type-C connector, 4G LTE support, and Bluetooth 4.1. It could also come with a 3D Touch-like display and might have two variants – a premium and sub-premium one.

Samsung might price the Galaxy S7 up to 10 percent lower than the Galaxy S6 thereby competing with rivals like Apple, Sony, HTC and LG, claims Chinese analyst Pan Jiutang.

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