Xiaomi Mi 5 has been in the news for a while because of its power packed specifications. The latest rumour on the upcoming flagship by the Chinese device manufacturer is that the smartphone will be released in 2016 with the newest and most powerful Snapdragon processor by Qualcomm.

Initially, the device was expected to be officially launched at an event today. Later, there were speculations that the smartphone will be released by the end of this year and will not get the latest Snapdragon 820 chipset. Instead the smartphone will be packed with the MediaTek’s deca-core Helio X20 SoC (system on chip).

As reported by Uber Gizmo, the Mi 5 will not be launch on Oct. 19 confirmed Xiaomi co-founder Lin Bin. Instead, the handset will arrive by early next year with the Snapdragon 820 SoC on board. Qualcomm has already slated the launch of its most powerful mobile processor to date by the beginning of 2016.

Taking this into consideration, rumours say that the launch of Xiaomi Mi 5 has been delayed to incorporate the latest Snapdragon 820 chipset into upcoming flagship device. With 2.2 GHz quad-core and 1.8GHz quad-core CPUs the new chip is said to be 35 percent faster and 30 percent more power efficient compared to its predecessor.

Moreover, all the potential owners of the Xiaomi Mi 5 can also expect Qualcomm’s ultrasonic fingerprint recognition technology. The new technology using 3D mapped fingerprints, can even work with wet and dirty finger. The new Snapdragon Sense ID 3D Fingerprint technology uses minute details of the skin to improve accuracy. The technology does not require capacitive sensor and manufacturers can place the sensor behind the display.

The Xiaomi Mi 5 is expected to feature a 5.3-inch IPS display with 16MP rear camera along with 5MP front snapper. The device will come packed with 4 GB of RAM coupled with 16 GB and 64 GB internal storage with microUSB connectivity and houses a 3030 mAh Lithium-Polymer battery.

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