Samsung's upcoming Galaxy S7 smartphone is reportedly going to come out with a liquid cooling capability. This particular feature is expected to improve the performance of the Korean tech giant's next generation flagship smartphone.

The Snapdragon 810 processor of the Galaxy S7 has been tested and found to be a "hot" chip. This problem could eventually develop into an overheating issue had Samsung not slaved at fixing it as soon as possible.

After working behind closed doors, Samsung's developers figured out a way to engineer the heat around the silicon and balance its cores. The combination of hardware engineering and software balancing turned out to be the solution the potentially huge problem needed.

Samsung has recently sourced a supplier for "heat pipe supplies”, Slash Gear has reported. These materials are commonly used for improving circuit boards to create channels away from the device's components prone to overheating. Examples of these components are the smartphone's SoC core.

Instead of applying the concept of air cooling, these heat pipe supplies are going to be filled with a type of liquid that will provide more efficient heat conductivity. Once the device's internals start to get hot, the heat is absorbed by the liquid.

Thermal dynamics will then begin and this involves moving the heat-absorbing liquid around the system. This way, it’s much easier for the unit to release the heat over a much wider area that holds non-critical components.

Considering Samsung intends to retain the design language of the Galaxy S series, dissipating heat could turn out to be a huge challenge for the company's developers, according to Forbes. The Galaxy S7 is expected to feature the same "mostly glass front and back" design featured in the Galaxy S6 and the Galaxy S6 Edge.

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